以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
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Rumors of a redesigned MacBook Pro with an OLED touchscreen have been floating around for some time, but that probably won't arrive until late 2026 in the M6 generation at the very earliest, per Bloomberg's Mark Gurman.。爱思助手下载最新版本对此有专业解读
World Service,·17 Feb 2026,·26 mins